PCB Laser Depaneling Machine FPC laser Cutting Depaneling With ±20 μM Precision For FR4 PCB Or FPC Boards

PCB Laser Cutting Machine PCB Depaneling with ±20 μm Precision for FR4 PCB Boards Laser PCB Separator Advantages
 

• The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
• In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
• The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
• The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
• The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.

 
Laser PCB Separator Machine Principle
 

 
Laser PCB Separator Parameter
 

 
Laser PCB Separator Features
 
1. Neat and smooth edge, no burr or overflow
2. More quick and easy, shorten the delivery time
3. High quality ,no distortion,surface clean& uniformity
4. Gathering the CNC tech,laser tech,software tech…High accuracy,High speed.
 
Product Photos

 


 
Our Service

# 1 day delivery
# 24 hours fast response
# Largest manufactory in South China
# 100% responsible for quality
# 14 years experience
# 1 year warranty