SMT, the full name of SurfaceMountingTechnology,Chinese surface mount technology, originally from the 1960s, is the assembly of SMD parts directly on the PCB, the biggest advantage is that each part has a very high unit area Increase wiring performance and shorten connection lines to improve electrical performance.

Program adjustment and placement machine

According to the sample BOM position map provided by the customer, the coordinates of the position of the patch component are performed. Then carry out the first piece with the SMT chip processing data provided by the customer.

Printing solder paste

Printing the solder paste with a steel mesh onto the PCB requires soldering the pads of the electronic component SMD to prepare for soldering of the components. The equipment used is a screen printing machine (printing machine), which is located at the forefront of the SMT chip processing line.

SPI

Solder paste detector, testing solder paste printing is a good product, with or without less tin, leaking tin, poly tin and other undesirable phenomena.

Patch

The electronic component SMD is accurately mounted to a fixed position on the PCB. The equipment used is a placement machine located behind the screen printing machine in the SMT production line.

The placement machine is divided into a high speed machine and a general purpose machine.

High-speed machine: for large pin spacing, small components

Universal machine: A component with a small pin pitch (tight pin) and a large volume.

05 high temperature solder paste melting

The main purpose is to melt the solder paste through high temperature. After cooling, the electronic component SMD and the PCB board are firmly soldered together. The equipment used is a reflow oven located behind the placement machine in the SMT production line.

AOI

Automatic optical detector to detect the welding components, such as tombstoning, displacement, and empty welding.

Visual inspection

The key items of manual inspection and inspection: whether the version of PCBA is a modified version; whether the customer requires components to use substitute materials or components of designated brands and brands; IC, diode, triode, tantalum capacitor, aluminum capacitor, switch, etc. Whether the direction of the component in the direction is correct; defects after soldering: short circuit, open circuit, false object, false welding.

Packaging

Qualified products will be tested and packaged separately. The packaging materials generally used are anti-static bubble bags, electrostatic cotton, and blister disks. There are two main packaging methods. One is to use anti-static bubble bags or electrostatic cotton to form a roll, which is the most commonly used packaging method. The second is to customize the plastic tray according to the size of PCBA. A PCBA board that is placed in a blister tray and is mainly sensitive to the needle and has a fragile patch component.

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