Dongguan Chuangwei Electronic Equipment Manufactory

ChuangWei Electronic Equipment Manufactory

We are the first Factory in China that provides TOTAL FULL SOLUTION for Electronic factories. 

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Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W

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Good quality PCB Depaneling for sales
Good quality PCB Depaneling for sales
The router works fine. I would like to special thanks to you one more time for your support!

—— Ahmet

I was set up your machine one week ago. İt’s good working. Thank you for all.

—— Erdem

The machine operates well, we will purchase it again

—— Jon

The machine works very well, now we train all workers.

—— Michal

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Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W

China Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W supplier
Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W supplier Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W supplier

Large Image :  Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W

Product Details:

Place of Origin: China
Brand Name: Chuangwei
Certification: CE
Model Number: CWVC-5S

Payment & Shipping Terms:

Minimum Order Quantity: 1 set
Price: Negotiable
Packaging Details: plywood case
Delivery Time: 3 work days
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Detailed Product Description
Max PCB Size: 600*460mm Max Component Height: 11mm
Laser Source: UV, CO2 Cutting Precision: ±20 μm
Name: PCB Laser Depaneling Weight: 500Kg

 

Industrial PCB Laser Depaneling with Different Laser Source 10/12/15/18W

 

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

 

Challenges of Depaneling using Routing/Die Cutting/Dicing Saws

 

Damages and fractures to substrates and circuits due to mechanical stress

Damages to PCB due to accumulated debris

Constant need for new bits, custom dies, and blades

Lack of versatility – each new application requires ordering of custom tools, blades, and dies

Not good for high precision, multi-dimensional or complicated cuts

Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

 

Advantages of Laser PCB depaneling/singulation

 

  • No mechanical stress on substrates or circuits

  • No tooling cost or consumables.

  • Versatility – ability to change applications by simply changing settings

  • Fiducial Recognition – more precise and clean cut

  • Optical Recognition before PCB depaneling/singulation process begins. CMS Laser is one of the few companies to provide this feature.

  • Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

  • Extraordinary cut quality holding tolerances as small as < 50 microns.

  • No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

 

Specification:

 

Parameter

 

 

 

 

 

 

 

 

Technical parameters

Main body of laser

1480mm*1360mm*1412 mm

Weight of the

1500Kg

Power

AC220 V

Laser

355 nm

Laser

 

Optowave 10W(US)

Material

≤1.2 mm

Precisio

±20 μm

Platfor

±2 μm

Platform

±2 μm

Working area

600*450 mm

Maximum

3 KW

Vibrating

CTI(US)

Power

AC220 V

Diameter

20±5 μm

Ambient

20±2 ℃

Ambient

<60 %

The Machine

Marble

 

Business Partners:

 
Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W

Contact Details
Dongguan Chuangwei Electronic Equipment Manufactory

Contact Person: Alan Cao

Tel: +8613922521978

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