ChuangWei Electronic Equipment Manufactory

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Home ProductsLaser Depaneling Machine

10W UV Optowave Laser PCB Separator Machine For Non Contact Depaneling

Certification
Good quality PCB Depaneling for sales
Good quality PCB Depaneling for sales
The router works fine. I would like to special thanks to you one more time for your support!

—— Ahmet

I was set up your machine one week ago. İt’s good working. Thank you for all.

—— Erdem

The machine operates well, we will purchase it again

—— Jon

The machine works very well, now we train all workers.

—— Michal

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10W UV Optowave Laser PCB Separator Machine For Non Contact Depaneling

China 10W UV Optowave Laser PCB Separator Machine For Non Contact Depaneling supplier
10W UV Optowave Laser PCB Separator Machine For Non Contact Depaneling supplier 10W UV Optowave Laser PCB Separator Machine For Non Contact Depaneling supplier 10W UV Optowave Laser PCB Separator Machine For Non Contact Depaneling supplier

Large Image :  10W UV Optowave Laser PCB Separator Machine For Non Contact Depaneling

Product Details:

Place of Origin: China
Brand Name: chuangwei
Certification: CE
Model Number: CWVC-5L

Payment & Shipping Terms:

Minimum Order Quantity: 1 set
Price: Negotiable
Packaging Details: plywood case
Delivery Time: 7 days
Payment Terms: T/T, Western Union, L/C
Supply Ability: 260 sets per month
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Detailed Product Description
Wave Length: 355um Super: Low Power Consumption
Laser: 12/15/17W Laser Brand: Optowave
Power: 220V 380v Warranty: 1 Year
Name: Laser PCB Separator

 
10W UV Optowave Laser PCB Separator Machine For Non Contact Depaneling
 
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.
 
Challenges of Depaneling using Routing/Die Cutting/Dicing Saws
 

  • Damages and fractures to substrates and circuits due to mechanical stress
  • Damages to PCB due to accumulated debris
  • Constant need for new bits, custom dies, and blades
  • Lack of versatility – each new application requires ordering of custom tools, blades, and dies
  • Not good for high precision, multi-dimensional or complicated cuts
  • Not useful PCB depaneling/singulation smaller boards

 
Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.
 
Advantages of Laser PCB Depaneling/Singulation
 

  • No mechanical stress on substrates or circuits
  • No tooling cost or consumables.
  • Versatility – ability to change applications by simply changing settings
  • Fiducial Recognition – more precise and clean cut
  • Optical Recognition before PCB depaneling/singulation process begins.
  • Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
  • Extraordinary cut quality holding tolerances as small as < 50 microns.
  • No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

 
Laser PCB Depaneling Specification
 

Laser class1
Max. working area (X x Y x Z)300 mm x 300 mm x 11 mm
Max. recognition area (X x Y)300 mm x 300 mm
Max. material size (X x Y)350 mm x 350 mm
Data input formatsGerber, X-Gerber, DXF, HPGL,
Max. structuring speedDepends on application
Positioning accuracy± 25 μm (1 Mil)
Diameter of focused laser beam20 μm (0.8 Mil)
Laser wavelength355 nm
System dimensions (W x H x D)1000mm*940mm
*1520 mm
Weight~ 450 kg (990 lbs)
Operating conditions 
Power supply230 VAC, 50-60 Hz, 3 kVA
CoolingAir-cooled (internal water-air cooling)
Ambient temperature22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)
Humidity< 60 % (non-condensing)
Required accessoiresExhaust unit

 

Contact Details
Dongguan Chuangwei Electronic Equipment Manufactory

Contact Person: Alan Cao

Tel: +8613922521978

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