ChuangWei Electronic Equipment Manufactory

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Better Yield Solder Carrier Soldering PCB Pallet Durostone Material

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Good quality PCB Depaneling for sales
Good quality PCB Depaneling for sales
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Better Yield Solder Carrier Soldering PCB Pallet Durostone Material

China Better Yield Solder Carrier Soldering PCB Pallet Durostone Material supplier
Better Yield Solder Carrier Soldering PCB Pallet Durostone Material supplier Better Yield Solder Carrier Soldering PCB Pallet Durostone Material supplier Better Yield Solder Carrier Soldering PCB Pallet Durostone Material supplier

Large Image :  Better Yield Solder Carrier Soldering PCB Pallet Durostone Material

Product Details:

Place of Origin: Dongguang China
Brand Name: Chuangwei
Certification: CE ISO
Model Number: CWSC-3

Payment & Shipping Terms:

Minimum Order Quantity: 1 set
Price: Negotiable
Packaging Details: each set be packed in plywood case
Delivery Time: 1-3 days after payment confirm
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
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Detailed Product Description
Life Cycle: 20000 Times Colour: Blue/ Black/ Grey
Condition: New Standard OperationTemperature: 260
Maximum Operation Temperature(C): 350 Sheet Size(mm): 2440×1220

 
Better Yield Solder Carrier Soldering PCB Pallet Durostone Material Used by most of our customers because of some advantages:
 
1.  Faster positioning on production line
2.  Low costs due to the missing of reinforced bars
3.  Better volume stocking
4.  Better yield with different board type on the production line
 
Surface-mount technology (SMT) is the leading factor driving higher circuit densities per square inch on PCBs. Directly attaching components and devices to the surface of circuit boards has enabled products to perform with much higher circuit speeds, allowed greater circuit density, and requires fewer external connections. These advances have greatly lowered costs, improved performance and product reliability. However, these benefits do not come without their challenges. Printing solder paste on diminishing pad sizes, placing smaller components, and reflowing entire assemblies with their varieties of termination finishes and materials are just a few of the technical challenges that process engineers face every day.
 
Specification:
 

ModelDurostoneCHP760DurostoneCAS761DurostoneCAG762
GradeStandardAnti-StaticAnti-static(Optical)
ColourBlueBlackGrey
Density(g/mm3)1.851.851.85
Standard OperationTemperature260260260
Maximum Operation Temperature(C)350350350
Sheet Size(mm)2440×12202440×12202440×1220
Tickness/weight(mm/kg)3/17, 4/225/28, 6/33, 8/4410/55, 12/66

 
 Better Yield Solder Carrier Soldering PCB Pallet Durostone Material
 
Our sales network
 
Better Yield Solder Carrier Soldering PCB Pallet Durostone Material

 
This Estimation may be done in three ways
 
If a PCB is available (preferably populated) - our sales engineers can rapidly evaluate your board. 
If PCB design data is available we will process, analyse and remotely assess it. 
You can do it using the rules presented below - our customers quickly find that the above two methods are easiest.

Gerber, Excellon and other data required 
Pin Land to SMT pad clearance evaluation

The two figures below each show part of a CSWSC in plan and section views. The right hand figure shows that more clearance
is required when the connector orientation is perpendicular to the wave.

 
Better Yield Solder Carrier Soldering PCB Pallet Durostone Material
 
PTH Components Located Parallel to direction through wave
The clearance required between the pin land and SMT pad can be made quite
small, as the solder does not have to flow "under" the component pockets.

 
 
Better Yield Solder Carrier Soldering PCB Pallet Durostone Material
 
PCB Design Implications - for Board Designers - or respin
 
We are often called upon by our customers to help with identifying design respin opportunities.
We will identify problem areas within a board and suggest appropriate movements of components. (Ideally before the PCB is fabricated)
However for board designers reading this, can you remember another four "rules" (to compete with the hundred other rules you have to have floating 
around in your head).

Keep large (height) SMT components away from PTH areas. 
Leave the leading and trailing areas around PTH components as clear as possible. 
DON'T put any SMT components within 3mm (0.12") of any PTH components. 
DON'T put all PTH components in line along one edge of a board - leave some space to allow us to support the masking in the centre of the board.

Contact Details
Dongguan Chuangwei Electronic Equipment Manufactory

Contact Person: Alan Cao

Tel: +8613922521978

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