Payment & Shipping Terms:
|Life Cycle:||20000 Times||Colour:||Blue/ Black/ Grey|
|Maximum Operation Temperature(C):||350||Sheet Size(mm):||2440×1220|
Reflow Tin Furnace Jig SMT Pallets / PCB Carrier With High Standard Durostone
Surface Mount Process Carriers are engineered to completely fixture a circuit board during the overall assembly process. These carriers are made of high-temperature semi-conductive composite materials, used from start to finish in the assembly process.
Surface Mount Process Carriers have many features and benefits which enhance automated assembly and increase production by:
1. Reducing set-up time.
2. Eliminating unnecessary PCB board handling by operators.
3. Minimizing board warping.
4. Eliminate expensive hand masking and labour costs.
5. Standardizing process repetition.
6. Machine parameters.
7. Minimizing soldering defects.
Surface Mount Process Carriers are made of composite materials with advantageous features such as:
1. High-temperature compatibility to endure repeated cycles through the re-flow.
2. Material stability to ensure board alignment is consistent.
3. Chemical resistance for increased durability through harsh cleaning process.
|Maximum Operation Temperature(C)||350||350||350|
|Tickness/weight(mm/kg)||3/17, 4/22||5/28, 6/33, 8/44||10/55, 12/66|
Our sales network
This estimation may be done in three ways
If a PCB is available (preferably populated) - our sales engineers can rapidly evaluate your board.
If PCB design data is available we will process, analyse and remotely assess it.
You can do it using the rules presented below - our customers quickly find that the above two methods are easiest.
Gerber, Excellon and other data required
Pin Land to SMT pad clearance evaluation
The two figures below each show part of a CSWSC in plan and section views. The right hand figure shows that more clearance
is required when the connector orientation is perpendicular to the wave.
PTH Components Located Parallel to direction through wave
The clearance required between the pin land and SMT pad can be made quite
small, as the solder does not have to flow "under" the component pockets.
PCB Design Implications - for Board Designers - or respin
We are often called upon by our customers to help with identifying design respin opportunities.
We will identify problem areas within a board and suggest appropriate movements of components. (Ideally before the PCB is fabricated)
However for board designers reading this, can you remember another four "rules" (to compete with the hundred other rules you have to have floating
around in your head).
Keep large (height) SMT components away from PTH areas.
Leave the leading and trailing areas around PTH components as clear as possible.
DON'T put any SMT components within 3mm (0.12") of any PTH components.
DON'T put all PTH components in line along one edge of a board - leave some space to allow us to support the masking in the centre of the board.