ChuangWei Electronic Equipment Manufactory

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Lead Free Solder Pallet SMT Process Carrier Pallet With 20000 times Life Cycle

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Good quality PCB Depaneling for sales
Good quality PCB Depaneling for sales
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I was set up your machine one week ago. İt’s good working. Thank you for all.

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The machine operates well, we will purchase it again

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The machine works very well, now we train all workers.

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Lead Free Solder Pallet SMT Process Carrier Pallet With 20000 times Life Cycle

China Lead Free Solder Pallet SMT Process Carrier Pallet With 20000 times Life Cycle supplier
Lead Free Solder Pallet SMT Process Carrier Pallet With 20000 times Life Cycle supplier Lead Free Solder Pallet SMT Process Carrier Pallet With 20000 times Life Cycle supplier Lead Free Solder Pallet SMT Process Carrier Pallet With 20000 times Life Cycle supplier

Large Image :  Lead Free Solder Pallet SMT Process Carrier Pallet With 20000 times Life Cycle

Product Details:

Place of Origin: Dongguang China
Brand Name: Chuangwei
Certification: CE ISO
Model Number: CWSC-3

Payment & Shipping Terms:

Minimum Order Quantity: 1 set
Price: Negotiable
Packaging Details: each set be packed in plywood case
Delivery Time: 1-3 days after payment confirm
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
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Detailed Product Description
Life Cycle: 20000 Times Colour: Blue/ Black/ Grey
Condition: New Standard OperationTemperature: 260
Maximum Operation Temperature(C): 350 Sheet Size(mm): 2440×1220

  
Lead Free Solder Pallet SMT Process Carrier Pallet With One Year WarrantySpecification:

 

Model DurostoneCHP760 DurostoneCAS761 DurostoneCAG762
Grade Standard Anti-Static Anti-static(Optical)
Colour Blue Black Grey
Density(g/mm3) 1.85 1.85 1.85
Standard OperationTemperature 260 260 260
Maximum Operation Temperature(C) 350 350 350
Sheet Size(mm) 2440×1220 2440×1220 2440×1220
Tickness/weight(mm/kg) 3/17, 4/22 5/28, 6/33, 8/44 10/55, 12/66

 Lead Free Solder Pallet SMT Process Carrier Pallet With 20000 times Life Cycle
  
Used by most of our customers because of some advantages:
 
1. Faster positioning on production line
2. Low costs due to the missing of reinforced bars
3. Better volume stocking
4. Better yield with different board type on the production line
 
Surface-mount technology (SMT) is the leading factor driving higher circuit densities per square inch on PCBs. Directly attaching components and devices to the surface of circuit boards has enabled products to perform with much higher circuit speeds, allowed greater circuit density, and requires fewer external connections. These advances have greatly lowered costs, improved performance and product reliability. However, these benefits do not come without their challenges. Printing solder paste on diminishing pad sizes, placing smaller components, and reflowing entire assemblies with their varieties of termination finishes and materials are just a few of the technical challenges that process engineers face every day.
 
Our sales network
 
Lead Free Solder Pallet SMT Process Carrier Pallet With 20000 times Life Cycle
  
This estimation may be done in three ways


If a PCB is available (preferably populated) - our sales engineers can rapidly evaluate your board. 
If PCB design data is available we will process, analyse and remotely assess it. 
You can do it using the rules presented below - our customers quickly find that the above two methods are easiest.
Gerber, Excellon and other data required 
Pin Land to SMT pad clearance evaluation
The two figures below each show part of a CSWSC in plan and section views. The right hand figure shows that more clearance
is required when the connector orientation is perpendicular to the wave.
 
Lead Free Solder Pallet SMT Process Carrier Pallet With 20000 times Life Cycle


PTH Components Located Parallel to direction through wave
The clearance required between the pin land and SMT pad can be made quite
small, as the solder does not have to flow "under" the component pockets.
 
 
 
 
Lead Free Solder Pallet SMT Process Carrier Pallet With 20000 times Life Cycle
 
PCB Design Implications - for Board Designers - or respin
 
We are often called upon by our customers to help with identifying design respin opportunities.
We will identify problem areas within a board and suggest appropriate movements of components. (Ideally before the PCB is fabricated)
However for board designers reading this, can you remember another four "rules" (to compete with the hundred other rules you have to have floating 
around in your head).
Keep large (height) SMT components away from PTH areas. 
Leave the leading and trailing areas around PTH components as clear as possible. 
DON'T put any SMT components within 3mm (0.12") of any PTH components. 
DON'T put all PTH components in line along one edge of a board - leave some space to allow us to support the masking in the centre of the board.

Contact Details
Dongguan Chuangwei Electronic Equipment Manufactory

Contact Person: Alan Cao

Tel: +8613922521978

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